Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell and Device Manufacturing Method

ABSTRACT

A method is provided for determining an actual profile of an object printed on a substrate. The method can include receiving an actual spectrum signal associated with the object, selecting a first model profile, and generating a first model spectrum signal associated with the first model profile. The method can further include comparing the first model spectrum signal with the actual spectrum signal. If the first model spectrum signal and the actual spectrum signal do not match a desired tolerance, the aforementioned selecting, generating, and comparing can be repeated with a second model profile. The second model profile can be selected based on the first model spectrum signal having undergone an optimization process based on a number of variable parameters of the first model profile, where the number of variable parameters is reduced by approximating the first model profile to a single shape with a reduced number of variable parameters.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 11/520,789, now allowed, filed Sep. 14, 2006, entitled“Inspection Method and Apparatus, Lithographic Apparatus, LithographicProcessing Cell and Device Manufacturing Method,” which is incorporatedherein by reference in its entirety.

BACKGROUND

1. Field

The present invention relates to methods of inspection usable, forexample, in the manufacture of devices by lithographic techniques and tomethods of manufacturing devices using lithographic techniques.

2. Description of the Related Art

A lithographic apparatus is a machine that applies a desired patternonto a substrate, usually onto a target portion of the substrate. Alithographic apparatus can be used, for example, in the manufacture ofintegrated circuits (ICs). In that instance, a patterning device, whichis alternatively referred to as a mask or a reticle, may be used togenerate a circuit pattern to be formed on an individual layer of theIC. This pattern can be transferred onto a target portion (e.g.comprising part of, one, or several dies) on a substrate (e.g. a siliconwafer). Transfer of the pattern is typically via imaging onto a layer ofradiation-sensitive material (resist) provided on the substrate. Ingeneral, a single substrate will contain a network of adjacent targetportions that are successively patterned. Known lithographic apparatusinclude steppers, in which each target portion is irradiated by exposingan entire pattern onto the target portion at one time, and scanners, inwhich each target portion is irradiated by scanning the pattern througha radiation beam in a given direction (the “scanning” direction) whilesynchronously scanning the substrate parallel or anti-parallel to thisdirection. It is also possible to transfer the pattern from thepatterning device to the substrate by imprinting the pattern onto thesubstrate.

In order to monitor the lithographic process, it is necessary to measureparameters of the patterned substrate, for example the overlay errorbetween successive layers formed in or on it. There are varioustechniques for making measurements of the microscopic structures formedin lithographic processes, including the use of scanning electronmicroscopes and various specialized tools. One form of specializedinspection tool is a scatterometer in which a beam of radiation isdirected onto a target on the surface of the substrate and properties ofthe scattered or reflected beam are measured. By comparing theproperties of the beam before and after it has been reflected orscattered by the substrate, the properties of the substrate can bedetermined. This can be done, for example, by comparing the reflectedbeam with data stored in a library of known measurements associated withknown substrate properties. Two main types of scatterometer are known.Spectroscopic scatterometers direct a broadband radiation beam onto thesubstrate and measure the spectrum (intensity as a function ofwavelength) of the radiation scattered into a particular narrow angularrange. Angularly resolved scatterometers use a monochromatic radiationbeam and measure the intensity of the scattered radiation as a functionof angle.

In order that the radiation that impinges on to the substrate isdiffracted, objects with a specific profile are printed on to thesubstrate and are often known as scatterometry profiles. Ideally, theobjects that are printed on to the substrate would have a predeterminedshape and would be printed perfectly each time they were printed.However, because of the size (of the order of a few nanometers) of theobjects, it is desirable to have a system to determine how exactly theobjects are shaped; i.e. it is desirable to know the profiles of theobjects. The objects may be diffraction gratings and the like which aremade up of an array of bars or other periodic structures but have across-section, which is the profile from the surface of the substrateupwards.

As mentioned above, it is possible to determine the actual shape of ascatterometry object using scanning electron microscopes and the like.However, this involves a large amount of time, effort and apparatus.

Another way in which to determine the profile of a scatterometry objectis to diffract a beam of radiation from the object and compare thediffraction pattern with model diffraction patterns that are stored in alibrary of diffraction patterns alongside the model profiles that createthese model patterns. This general concept is known in the art. Forexample, U.S. Patent Application Publication 2003/0028358 A1 (Niu etal.) describes a system in which an actual signal from a scatterometryobject is compared with a library of stored signals and the system triesto find a closest match of signals. The stored signals are each linkedto an object profile parameter. An object profile parameter may be, forinstance, the critical dimension (CD), a width of the object (which mayvary with height), the height of the object or the angle of a sidesurface of the object, this angle being measured either from the surfaceof the substrate or from a normal to the substrate surface. The documentgoes on to describe the method as finding a closest match of a signalwith each parameter of the scatterometry object. In other words, variouspossible parameters and possible permutations of parameters are testedto find a combination that gives rise to a signal that is as close tothe actual signal that has come from the scatterometry object aspossible. This gives a series of iterations of a “model signal”. Thismethod is repeated iteratively until the model signal is as close aspossible to the actual signal and then the model signal is storedalongside the parameters used. Finally, a computer checks a databasecomprising the parameters to determine if all parameter combinationshave been entered. In a given example, for a simplified parameter set ofthree (a CD, a height and a width), if the range of the CD is 100 to 120nm and the resolution is 1 nm, then there are 21 possible parametervalues for CD. If there are also 21 possible values for height and 21possible values for width, there are a total of 21×21×21=9261 possibleparameter value combinations. The computer checks to see if all 9261combinations have been simulated and stored in the database. Thecomputer builds the database by simulating all of the possiblecombinations. Clearly, the problem with this system is that the greaterthe number of parameters, the greater the number of iterations that thecomputer must carry out and the greater the processing power and timethat is required.

U.S. Patent Application Publication 2004/0210402 A1 (Opsal et al.)defines a system that aims to reduce the number of parameters requiredto build up the profile of an object from the scatterometry signals. Theway the system does this is by providing “control points” around theoutside of the profile shape from which the profile shape may be builtup. For example, a square-profiled object has a single control point toshow its height from the substrate surface and two points to show awidth. The points are then joined up in a “dot-to-dot” fashion to give aline profile. The more complex the shape, the larger the number ofcontrol points is required to build up an accurate line profile.Furthermore, this system does not work well for overlapping shapes (e.g.complex shapes that look like overlapping simpler shapes or a profilethat has a coating) or multiple shapes in a single profile, as the linesjoining the dots may easily join the wrong dots.

Another problem with this system is that each control point will have atleast one (if not two or three) degree of freedom. Each degree offreedom translates to a parameter that may change and the computingpower is not reduced by very much, even though the parameters arechanged.

SUMMARY

It is desirable to provide a system that reduces the number of degreesof freedom of measurement points or parameters in a scatterometry objectin order to provide a quick method of reconstructing the profile of ascatterometry object from its diffraction spectrum.

According to an embodiment of the invention, a method of reconstructingthe shape of an object from a diffraction pattern resulting fromradiation illuminating the object comprises detecting the diffractionpattern of radiation diffracted from the object; estimating the objectshape; deriving a model diffraction pattern from the estimated shape;comparing the model diffraction pattern and the detected diffractionpattern; determining the actual object shape from the difference betweenthe model diffraction pattern and the detected diffraction pattern,wherein the object shape is defined as a plurality of two- orthree-dimensional shapes each with a plurality of variable geometricparameters; and linking together the variable geometric parameters ofthe different two- or three-dimensional shapes to give an approximationof an object shape defined by a two- or three-dimensional shape with areduced number of variable parameters.

According to another embodiment of the invention, a method ofdetermining an actual profile of an object, the object having beenprinted on a substrate, comprises (i) receiving an actual spectrumsignal associated with the object; (ii) selecting a first model profile;(iii) generating a first model spectrum signal associated with the firstmodel profile; (iv) comparing the first model spectrum signal with theactual spectrum signal; and, if the first spectrum signal and the actualspectrum signal do not match to a desired tolerance, (v) carrying out(ii) to (iv) with a second model profile, wherein the second modelprofile is selected based on the first model spectrum signal havingundergone an optimization process based on each of a number of variableparameters of the first model profile, the number of variable parametershaving been reduced by approximating the first model profile to a singleshape with a reduced number of variable parameters.

According to another embodiment of the invention, an inspectionapparatus, a lithographic apparatus or a lithographic cell configured tomeasure a property of a substrate comprises (i) a detector configured toreceive an actual spectrum signal associated with an object on thesubstrate; (ii) a controller configured to select a first model profile;(iii) a generator configured to generate a first model spectrum signalassociated with the first model profile; (iv) a comparator configured tocompare the first model spectrum signal with the actual spectrum signal;and if the first spectrum signal and the actual spectrum signal do notmatch to within a desired tolerance, (v) the controller, generator andcomparator are configured to carry out (ii) to (iv) with a second modelprofile, wherein the second model profile is selected based on the firstmodel spectrum signal having undergone an optimization process based oneach of a number of variable parameters of the first model profile, thenumber of variable parameters having been reduced by approximating thefirst model profile to a single shape with a reduced number of variableparameters.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of exampleonly, with reference to the accompanying schematic drawings in whichcorresponding reference symbols indicate corresponding parts, and inwhich:

FIG. 1 a depicts a lithographic apparatus;

FIG. 1 b depicts a lithographic cell or cluster;

FIG. 2 depicts a first embodiment of a scatterometer;

FIG. 3 depicts a second embodiment of a scatterometer;

FIG. 4 depicts three stages of the method according to the presentinvention;

FIG. 5 depicts three further stages of the method according to thepresent invention;

FIG. 6 depicts overlapping profiles;

FIG. 7 depicts a plurality of profiles in a single cell;

FIG. 8 depicts an asymmetrical profile; and

FIG. 9 depicts a two-dimensional object shape and its equivalentthree-dimensional object shape.

DETAILED DESCRIPTION

FIG. 1 a schematically depicts a lithographic apparatus. The apparatuscomprises an illumination system (illuminator) IL configured tocondition a radiation beam B (e.g. UV radiation or EUV radiation). Asupport (e.g. a mask table) MT is configured to support a patterningdevice (e.g. a mask) MA and is connected to a first positioner PMconfigured to accurately position the patterning device in accordancewith certain parameters. A substrate table (e.g. a wafer table) WT isconfigured to hold a substrate (e.g. a resist-coated wafer) W and isconnected to a second positioner PW configured to accurately positionthe substrate in accordance with certain parameters. A projection system(e.g. a refractive projection lens system) PL is configured to project apattern imparted to the radiation beam B by patterning device MA onto atarget portion C (e.g. comprising one or more dies) of the substrate W.

The illumination system may include various types of optical components,such as refractive, reflective, magnetic, electromagnetic, electrostaticor other types of optical components, or any combination thereof, todirect, shape, and/or control radiation.

The support supports, e.g. bears the weight of, the patterning device.It holds the patterning device in a manner that depends on theorientation of the patterning device, the design of the lithographicapparatus, and other conditions, such as for example whether or not thepatterning device is held in a vacuum environment. The support can usemechanical, vacuum, electrostatic or other clamping techniques to holdthe patterning device. The support may be a frame or a table, forexample, which may be fixed or movable as required. The support mayensure that the patterning device is at a desired position, for examplewith respect to the projection system. Any use of the terms “reticle” or“mask” herein may be considered synonymous with the more general term“patterning device.”

The term “patterning device” used herein should be broadly interpretedas referring to any device that can be used to impart a radiation beamwith a pattern in its cross-section such as to create a pattern in atarget portion of the substrate. It should be noted that the patternimparted to the radiation beam may not exactly correspond to the desiredpattern in the target portion of the substrate, for example if thepattern includes phase-shifting features or so called assist features.Generally, the pattern imparted to the radiation beam will correspond toa particular functional layer in a device being created in the targetportion, such as an integrated circuit.

The patterning device may be transmissive or reflective. Examples ofpatterning devices include masks, programmable mirror arrays, andprogrammable LCD panels. Masks are well known in lithography, andinclude mask types such as binary, alternating phase-shift, andattenuated phase-shift, as well as various hybrid mask types. An exampleof a programmable mirror array employs a matrix arrangement of smallmirrors, each of which can be individually tilted so as to reflect anincoming radiation beam in different directions. The tilted mirrorsimpart a pattern in a radiation beam, which is reflected by the mirrormatrix.

The term “projection system” used herein should be broadly interpretedas encompassing any type of projection system, including refractive,reflective, catadioptric, magnetic, electromagnetic and electrostaticoptical systems, or any combination thereof, as appropriate for theexposure radiation being used, or for other factors such as the use ofan immersion liquid or the use of a vacuum. Any use of the term“projection lens” herein may be considered as synonymous with the moregeneral term “projection system”.

As here depicted, the apparatus is of a transmissive type (e.g.employing a transmissive mask). Alternatively, the apparatus may be of areflective type (e.g. employing a programmable mirror array of a type asreferred to above, or employing a reflective mask).

The lithographic apparatus may be of a type having two (dual stage) ormore substrate tables (and/or two or more mask tables). In such“multiple stage” machines the additional tables may be used in parallel,or preparatory steps may be carried out on one or more tables while oneor more other tables are being used for exposure.

The lithographic apparatus may also be of a type wherein at least aportion of the substrate may be covered by a liquid having a relativelyhigh refractive index, e.g. water, so as to fill a space between theprojection system and the substrate. An immersion liquid may also beapplied to other spaces in the lithographic apparatus, for example,between the mask and the projection system. Immersion techniques arewell known in the art for increasing the numerical aperture ofprojection systems. The term “immersion” as used herein does not meanthat a structure, such as a substrate, must be submerged in liquid, butrather only means that liquid is located between the projection systemand the substrate during exposure.

Referring to FIG. 1 a, the illuminator IL receives radiation from aradiation source SO. The source and the lithographic apparatus may beseparate entities, for example when the source is an excimer laser. Insuch cases, the source is not considered to form part of thelithographic apparatus and the radiation is passed from the source SO tothe illuminator IL with the aid of a beam delivery system BD comprising,for example, suitable directing mirrors and/or a beam expander. In othercases the source may be an integral part of the lithographic apparatus,for example when the source is a mercury lamp. The source SO and theilluminator IL, together with the beam delivery system BD if required,may be referred to as a radiation system.

The illuminator IL may comprise an adjuster AD for adjusting the angularintensity distribution of the radiation beam. Generally, at least theouter and/or inner radial extent (commonly referred to as σ-outer andσ-inner, respectively) of the intensity distribution in a pupil plane ofthe illuminator can be adjusted. In addition, the illuminator IL maycomprise various other components, such as an integrator IN and acondenser CO. The illuminator may be used to condition the radiationbeam, to have a desired uniformity and intensity distribution in itscross-section.

The radiation beam B is incident on the patterning device (e.g., maskMA), which is held on the support (e.g., mask table MT), and ispatterned by the patterning device. Having traversed the mask MA, theradiation beam B passes through the projection system PL, which focusesthe beam onto a target portion C of the substrate W. With the aid of thesecond positioner PW and position sensor IF (e.g. an interferometricdevice, linear encoder or capacitive sensor), the substrate table WT canbe moved accurately, e.g. so as to position different target portions Cin the path of the radiation beam B. Similarly, the first positioner PMand another position sensor (which is not explicitly depicted in FIG. 1a) can be used to accurately position the mask MA with respect to thepath of the radiation beam B, e.g. after mechanical retrieval from amask library, or during a scan. In general, movement of the mask tableMT may be realized with the aid of a long-stroke module (coarsepositioning) and a short-stroke module (fine positioning), which formpart of the first positioner PM. Similarly, movement of the substratetable WT may be realized using a long-stroke module and a short-strokemodule, which form part of the second positioner PW. In the case of astepper (as opposed to a scanner) the mask table MT may be connected toa short-stroke actuator only, or may be fixed. Mask MA and substrate Wmay be aligned using mask alignment marks M1, M2 and substrate alignmentmarks P1, P2. Although the substrate alignment marks as illustratedoccupy dedicated target portions, they may be located in spaces betweentarget portions (these are known as scribe-lane alignment marks).Similarly, in situations in which more than one die is provided on themask MA, the mask alignment marks may be located between the dies.

The depicted apparatus could be used in at least one of the followingmodes:

1. In step mode, the mask table MT and the substrate table WT are keptessentially stationary, while an entire pattern imparted to theradiation beam is projected onto a target portion C at one time (i.e. asingle static exposure). The substrate table WT is then shifted in the Xand/or Y direction so that a different target portion C can be exposed.In step mode, the maximum size of the exposure field limits the size ofthe target portion C imaged in a single static exposure.

2. In scan mode, the mask table MT and the substrate table WT arescanned synchronously while a pattern imparted to the radiation beam isprojected onto a target portion C (i.e. a single dynamic exposure). Thevelocity and direction of the substrate table WT relative to the masktable MT may be determined by the (de-) magnification and image reversalcharacteristics of the projection system PL. In scan mode, the maximumsize of the exposure field limits the width (in the non-scanningdirection) of the target portion in a single dynamic exposure, whereasthe length of the scanning motion determines the height (in the scanningdirection) of the target portion.

3. In another mode, the mask table MT is kept essentially stationaryholding a programmable patterning device, and the substrate table WT ismoved or scanned while a pattern imparted to the radiation beam isprojected onto a target portion C. In this mode, generally a pulsedradiation source is employed and the programmable patterning device isupdated as required after each movement of the substrate table WT or inbetween successive radiation pulses during a scan. This mode ofoperation can be readily applied to maskless lithography that utilizesprogrammable patterning device, such as a programmable mirror array of atype as referred to above.

Combinations and/or variations on the above described modes of use orentirely different modes of use may also be employed.

As shown in FIG. 1 b, the lithographic apparatus LA forms part of alithographic cell LC, also sometimes referred to a lithocell or cluster,which also includes apparatus to perform pre- and post-exposureprocesses on a substrate. Conventionally these include spin coaters SCto deposit resist layers, developers DE to develop exposed resist, chillplates CH and bake plates BK. A substrate handler, or robot, RO picks upsubstrates from input/output ports I/O1, I/O2, moves them between thedifferent process apparatus and delivers then to the loading bay LB ofthe lithographic apparatus. These devices, which are often collectivelyreferred to as the track, are under the control of a track control unitTCU which is itself controlled by the supervisory control system SCS,which also controls the lithographic apparatus via lithography controlunit LACU. Thus, the different apparatus can be operated to maximizethroughput and processing efficiency.

In order that the substrates that are exposed by the lithographicapparatus are exposed correctly and consistently, it is desirable toinspect exposed substrates to measure properties such as overlay errorsbetween subsequent layers, line thicknesses, critical dimensions (CD),etc. If errors are detected, adjustments may be made to exposures ofsubsequent substrates, especially if the inspection can be done soon andfast enough that other substrates of the same batch are still to beexposed. Also, already exposed substrates may be stripped and reworked,to improve yield, or discarded, thereby avoiding performing exposures onsubstrates that are known to be faulty. In a case where only some targetportions of a substrate are faulty, further exposures can be performedonly on those target portions that are good.

An inspection apparatus is used to determine the properties of thesubstrates, and in particular, how the properties of differentsubstrates or different layers of the same substrate vary from layer tolayer. The inspection apparatus may be integrated into the lithographicapparatus LA or the lithocell LC or may be a stand-alone device. Toenable most rapid measurements, it is desirable that the inspectionapparatus measure properties in the exposed resist layer immediatelyafter the exposure. However, the latent image in the resist has a verylow contrast, there is only a very small difference in refractive indexbetween the parts of the resist that have been exposed to radiation andthose that have not, and not all inspection apparatus have sufficientsensitivity to make useful measurements of the latent image. Thereforemeasurements may be taken after the post-exposure bake step (PEB), whichis customarily the first step carried out on exposed substrates andincreases the contrast between exposed and unexposed parts of theresist. At this stage, the image in the resist may be referred to assemi-latent. It is also possible to make measurements of the developedresist image, at which point either the exposed or unexposed parts ofthe resist have been removed, or after a pattern transfer step such asetching. The latter possibility limits the possibilities for rework offaulty substrates but may still provide useful information.

FIG. 2 depicts a scatterometer that may be used in the presentinvention. It comprises a broadband (white light) radiation projector 2that projects radiation onto a substrate W. The reflected radiation ispassed to a spectrometer detector 4, which measures a spectrum 10(intensity as a function of wavelength) of the specular reflectedradiation. From this data, the structure or profile giving rise to thedetected spectrum may be reconfigured, e.g. by Rigorous Coupled WaveAnalysis and non-linear regression or by comparison with a library ofsimulated spectra as shown at the bottom of FIG. 2. In general, for thereconstruction, the general form of the structure is known and someparameters are assumed from knowledge of the process by which thestructure was made, leaving only a few parameters of the structure to bedetermined from the scatterometry data. Such a scatterometer may beconfigured as a normal-incidence scatterometer or an oblique-incidencescatterometer.

Another scatterometer that may be used with the present invention isshown in FIG. 3. In this device, the radiation emitted by radiationsource 2 is focused using lens system 12 through interference filter 13and polarizer 17, reflected by partially reflected surface (beamsplitter) 16 and is focused onto substrate W via a microscope objectivelens 15, which has a high numerical aperture (NA), preferably at least0.9 and more preferably at least 0.95. Immersion scatterometers may evenhave lenses with numerical apertures over 1. The reflected radiationthen transmits through partially reflective surface 16 into a detector18 in order to have the scatter spectrum detected. The detector may belocated in the back-projected pupil plane 11, which is at the focallength of the lens system 15, however the pupil plane may instead bere-imaged with auxiliary optics (not shown) onto the detector. The pupilplane is the plane in which the radial position of radiation defines theangle of incidence and the angular position defines azimuth angle of theradiation, and any substantially conjugate plane. The detector ispreferably a two-dimensional detector so that a two-dimensional angularscatter spectrum of the substrate target can be measured. The detector18 may be, for example, an array of CCD or CMOS sensors, and may have anintegration time of, for example, 40 milliseconds per frame.

A reference beam is often used, for example, to measure the intensity ofthe incident radiation. To do this, when the radiation beam is incidenton the beam splitter 16, part of it is transmitted through the beamsplitter as a reference beam towards a reference mirror 14. Thereference beam is then projected onto a different part of the samedetector 18.

A set of interference filters 13 is available to select a wavelength ofinterest in the range of, for example, 405-790 nm or even lower, such as200-300 nm. The interference filter may be tunable rather thancomprising a set of different filters. A grating could be used insteadof interference filters.

The detector 18 may measure the intensity of scattered light at a singlewavelength (or narrow wavelength range), the intensity separately atmultiple wavelengths or integrated over a wavelength range. Furthermore,the detector may separately measure the intensity of transversemagnetic, and transverse electric-polarized light and/or the phasedifference between the transverse magnetic- and transverseelectric-polarized light.

Using a broadband light source (i.e. one with a wide range of lightfrequencies or wavelengths, and therefore of colors) is possible, whichgives a large etendue, allowing the mixing of multiple wavelengths. Theplurality of wavelengths in the broadband preferably each has abandwidth of λδ and a spacing of at least 2λδ (i.e. twice thewavelength). Several “sources” of radiation can be different portions ofan extended radiation source that have been split using fiber bundles.In this way, angle resolved scatter spectra can be measured at multiplewavelengths in parallel. A 3-D spectrum (wavelength and two differentangles) can be measured, which contains more information than a 2-Dspectrum. This allows more information to be measured which increasesmetrology process robustness. This is described in more detail in U.S.Patent Application Publications 2006/0066855 A1 and 2006/0033921 A1.

The target on substrate W may be a grating, which is printed such thatafter development, wherein the bars of the grating are formed of solidresist lines. The bars may alternatively be etched into the substrate.This pattern is sensitive to chromatic aberrations in the lithographicprojection apparatus, particularly the projection system PL, andillumination symmetry and the presence of such aberrations will manifestthemselves in a variation in the printed grating. Accordingly, thescatterometry data of the printed gratings is used to reconstruct thegratings. The parameters of the grating, such as line widths and shapes,may be input to the reconstruction process from knowledge of theprinting step and/or other scatterometry processes.

The present invention relates to the reconstruction of the target on thesubstrate W. The bars of the grating have a shape that includes theirlength and the shape of their cross section, as they are generallyassumed to be prism-shaped. The cross-sectional shape of a bar is knownas its profile. Hereafter, a bar will be referred to as a scatterometryobject. It must be noted, however, that the profile may also comprisethe entire 3-D object and not simply its cross-section. An example ofthis is when the scatterometry object is an array of “contact holes”.These contact holes are regarded as being made up of conical andcylindrical shapes such as that shown in FIG. 9. This particular examplewill be discussed later.

For reconstruction purposes, the profile is generally regarded as beingmade up of a stack of homogeneous rectangular cross-sectioned layers andtrapezoids (or cylinders and cones as mentioned above). A radiation beamis diffracted from the surface of the scatterometry object. Thisdiffracted beam is detected by a detector that then creates ascatterometry measurement signal from the diffraction pattern. Themeasurement signal is compared with a calculated signal that is based ona model profile defined by a stack of homogeneous layers and trapezoids.When the calculated signal does not match the measured signal, the modelprofile is altered so that the associated model signal is more similarto the actual profile of the actual object. This process is continueduntil the measurement signal and the calculated signal do match withinacceptable tolerances. The degrees of freedom that can be changed duringeach iteration are, for example, the height, the critical dimension(CD), the sidewall angle (e.g. the angle of the side wall of the profilewith respect to either the substrate surface or a normal to thesubstrate surface), an angle between tangents (or normals) of roundedsides, etc., or non-geometric parameters such as the refractive index ofthe materials from which the trapezoids are made or other opticalconstants. With each iteration, a new calculation is carried on aprofile with at least one changed degree of freedom in order to producea new model signal to compare with the measured signal.

A homogeneous layer that has, for example, a rectangular cross-section,has only a single geometric degree of freedom and that is its thickness(or height from the substrate surface). A trapezoid, on the other hand,has for example three degrees of freedom: its height, its sidewall angleand its CD at its bottom surface. A cone has at least two degrees offreedom; its height and its base diameter. The greater the number ofdegrees of freedom, the larger the chance of instable solutions andcross-correlations between the different degrees of freedom (the degreesof freedom are also known as the variable parameters). By “instablesolution,” the following is understood: it is assumed that the change inthe calculated signal is different for each degree of freedom. Inreality, the change in the calculated signal of different geometricalparameters can be similar, which makes it difficult for the optimizationalgorithm to find the right solution. In an example, a stack of twotrapezoids is the object for which the profile is being estimated.Increasing the height of the first trapezoid by a few nm and at the sametime decreasing the height of the second trapezoid by a few nm willyield very similar calculated signals (especially if the overall heightremains the same). Since the measurement signals are not free of noise,100 measurements of the same target will result in a wide variety ofresults. These results are known as instable results. In other words,there is cross correlation between parameters; i.e. the change in themeasurement signal can be explained by either a change in degree offreedom A, or a change in degree of freedom B. Sometimes theoptimization algorithm will choose A, sometimes B. It is the solution tothis instability that is sought with the present invention.

A large number of degrees of freedom occur when the profile of theobject comprises two or more different shapes that are stacked. Forexample, if one trapezoid is stacked upon another, the increasing of theheight of the lower trapezoid is strongly correlated with a decrease inheight of the upper trapezoid such that the overall height remains thesame. Instable solutions result in errors in the measurement of theprofiles and so the reconstructions of the targets on the substrate Ware likely to be flawed.

Classic reconstruction methods do not cope with large numbers of degreesof freedom very well. If there are, for example, M trapezoids in aprofile, each with N degrees of freedom, classic methods have to dealwith M×N degrees of freedom if discontinuities in the profile are takeninto account and N+M(N−1) degrees of freedom if the profiles do not havediscontinuities (e.g. in the case of neatly stacked trapezoids).

Another problem with this classic reconstruction method is that only asingle profile can be modeled at any one time. However, there are caseswhen more than one profile is present in a unit cell, for example, indouble patterning applications.

When two trapezoids are stacked to generate a more complex profile, thebottom of the top trapezoid is “attached” to the top of the bottomtrapezoid. In the following examples, the bottom trapezoid will becalled the “foot” and the top trapezoid will be called the “mainsegment”. Traditionally, the foot height and main segment height areseparate degrees of freedom. They are therefore separate parameters thatcan be adjusted independently and thus contribute to the iteration ofcalculations that must be carried out to determine the overall profileof the object. The present invention seeks to reduce the number ofdegrees of freedom, thus stabilizing the calculations. In order to dothis, a relationship is established between the height of the foot “F”and the height of the main segment “M” using simple mathematicalformulae; for example:

F=0.2×M;  (a)

F=30+0.1×M; or  (b)

F=30+M−M _(nominal)  (c)

In general, therefore, any degree of freedom or variable parameter canbe linked to any other degree of freedom or variable parameter using asimple formula. Even the refractive index of the material of a trapezoidmay be linked to the height of the trapezoid in specific processes suchas chemical vapor deposition (CVD).

The deduction of the formulae to be used is carried out as follows:before starting the building of a scatterometry model, a Focus ExposureMatrix (FEM) is measured. In a FEM, patterns are printed with a varietyof focus and dose settings, which create a large variation in profiles.By measuring the profile cross-sections of known object shapes, one candeduce the rules of the profiles and their associated scatterometryresults. Making these physical cross-sections takes a considerableamount of computational time. Different rules can be experimented withand chosen such that a particular rule can be obtained that combinesboth a good stability of the results and small to no differences betweenthe measured and calculated signals.

By linking degrees of freedom with each other, the number of degrees offreedom is reduced, leading to shorter calculation times, and morestable end results.

FIGS. 4 and 5 show the method carried out to link the various degrees offreedom. Any group of shapes can be transformed into an object with atmost three degrees of freedom by linking the degrees of freedom of thecomponent shapes together.

In FIG. 4, a stack of three trapezoids 20, 22, 24 is shown with a totalnumber of degrees of freedom of 7. The height and side angle of each ofthe trapezoids 20, 22, 24 are each independent degrees of freedom.However, the width of each of the trapezoids may be linked. In section aof FIG. 4, for example, the width of the top two trapezoids 20, 22 maybe linked and so the width of the bottom trapezoid 24 is the seventhdegree of freedom, along with the height and side wall angle of each ofthe trapezoids. In section b of FIG. 4, the top and bottom trapezoid 20,24 widths can be linked and so the middle trapezoid width is the seventhdegree of freedom. In section c of FIG. 4, it may be the width of thetop trapezoid that is the independent degree of freedom. The widths ofthe different trapezoids are linked so that there are no discontinuitiesin the profile shape. In other words, the bottom CD of one trapezoidmust match the top CD of the adjacent trapezoid so that the profile ofthe two trapezoids together is continuous, as shown in FIG. 4, forexample. Once the CD of one trapezoid is known, the CDs of the othertrapezoids can be calculated using the sidewall angles and heights ofthe trapezoids.

By combining the bottom two trapezoids 22, 24 of FIG. 4, the two bottomtrapezoids 22′, 24′ of FIG. 5 can be treated as a single polygon p withonly three degrees of freedom, as shown in section a′ of FIG. 5. Insection b′, the bottom, larger trapezoid 26′ made up of the twotrapezoids has three degrees of freedom and the top trapezoid 20′ alsostill has three degrees of freedom. The single polygon p is now regardedas a single trapezoid, 26′. Figure c′ of FIG. 5 shows all threetrapezoids 20′, 22′, 24′ linked together to form a single trapezoid 28′with only three degrees of freedom for the whole profile.

The linking of degrees of freedom as shown in FIG. 4 or the combining ofshapes as shown in FIG. 5 both reduce the number of degrees of freedom,leading to more stable results. The results are more stable because ifthere is only one degree of freedom, then any change in measured signalhas to be translated into a change in that single parameter. If thereare many degrees of freedom, then many combinations of differentparameters will result in similar differences between the measured andcalculated signal. The fewer the number of degrees of freedom, the morelikely one of those degrees of freedom is to be the key to matching theestimated and actual profiles. The calculation is therefore more robust.

This method works for several types of profile shapes. There arescatterometry objects for which the profile is made of overlappingshapes. For example, a thin coating 2 may be provided around a gratingbar 1 as shown in FIG. 6. The shapes of the coating and of the gratingbar may be determined separately and then combined to obtain the profileof the coated bar. However, linking the two shapes enables thepossibility of keeping the coat thickness constant or allow for scalingwhen one of the profiles changes. With this definition, it is mucheasier to define and control coatings on a profile. For example,

bottom CD of coated element=bottom CD of main element+10 nm;  (d)

height of coated element=height of main element+5 nm;  (e)

sidewall angle of coated element=sidewall angle of main element.  (f)

The coating thickness can be known from previous measurements orexperimenting with an FEM as described above.

As mentioned above, it is possible to have more than one profile in aunit cell as shown in FIG. 7. Using a unit cell with linked degrees offreedom of the two profiles also helps to reduce the degrees of freedomrequired for the calculations to reconstruct the profiles. This allowsfor the modeling of gratings or targets that are printed withalternating phase shifting masks that contain a small phase error. Theprofiles in the same unit cell do not have to have the same parameters.

Usually, the centers of the various shapes within an object profile arehorizontally aligned. This makes the calculations easier for asymmetrical profile. However, it is possible to have an asymmetricalprofile such as that shown in FIG. 8. Knowing the X-positions (i.e. therelative horizontal alignments) of the different shapes enables modelingof more complex profiles. The linking of these profiles enables anefficient calculation even when shapes change.

For example:

Left sidewall angle of element A=right side wall angle of elementA+3□.  (g)

Only the right sidewall angle has to be defined and then the leftsidewall angle can be calculated.

This method also works for 3-D shapes such as that shown in FIG. 9.Section a shows a side view of a shape that is made up of a cylinderstacked on top of a frustum. The cylindrical part has a height h1 andthe frustum has a height h2. h1 and h2 may be linked such that one isdependent on the other in the same way as the foot and main segment ofthe trapezoid described in equations (a) to (c) above.

The advantages of having fewer degrees of freedom and therefore fewerparameters to measure gives more stable results. Calculation time istherefore reduced, minimizing cost and taking less time to discover asolution. More complex profiles may also therefore be handled.

Although specific reference may be made in this text to the use oflithographic apparatus in the manufacture of ICs, it should beappreciated that the lithographic apparatus described herein may haveother applications, such as the manufacture of integrated opticalsystems, guidance and detection patterns for magnetic domain memories,flat-panel displays, liquid-crystal displays (LCDs), thin film magneticheads, etc. It should be appreciated that, in the context of suchalternative applications, any use of the terms “wafer” or “die” hereinmay be considered as synonymous with the more general terms “substrate”or “target portion”, respectively. The substrate referred to herein maybe processed, before or after exposure, in for example a track (a toolthat typically applies a layer of resist to a substrate and develops theexposed resist), a metrology tool and/or an inspection tool. Whereapplicable, the disclosure herein may be applied to such and othersubstrate processing tools. Further, the substrate may be processed morethan once, for example in order to create a multi-layer IC, so that theterm substrate used herein may also refer to a substrate that alreadycontains multiple processed layers.

Although specific reference may have been made above to the use ofembodiments of the invention in the context of optical lithography, itwill be appreciated that the invention may be used in otherapplications, for example imprint lithography, and where the contextallows, is not limited to optical lithography. In imprint lithography, atopography in a patterning device defines the pattern created on asubstrate. The topography of the patterning device may be pressed into alayer of resist supplied to the substrate whereupon the resist is curedby applying electromagnetic radiation, heat, pressure or a combinationthereof. The patterning device is moved out of the resist leaving apattern in it after the resist is cured.

The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) radiation (e.g.having a wavelength of or about 365, 355, 248, 193, 157 or 126 nm) andextreme ultra-violet (EUV) radiation (e.g. having a wavelength in therange of 5-20 nm), as well as particle beams, such as ion beams orelectron beams.

The term “lens”, where the context allows, may refer to any one orcombination of various types of optical components, includingrefractive, reflective, magnetic, electromagnetic and electrostaticoptical components.

While specific embodiments of the invention have been described above,it will be appreciated that the invention may be practiced otherwisethan as described. For example, the invention may take the form of acomputer program containing one or more sequences of machine-readableinstructions describing a method as disclosed above, or a data storagemedium (e.g. semiconductor memory, magnetic or optical disk) having sucha computer program stored therein.

The descriptions above are intended to be illustrative, not limiting.Thus, it will be apparent to one skilled in the art that modificationsmay be made to the invention as described without departing from thescope of the claims set out below.

1. A method of determining an actual profile of an object, the objecthaving been printed on a substrate, the method comprising: receiving anactual spectrum signal associated with the object; selecting a firstmodel profile; generating a first model spectrum signal associated withthe first model profile; comparing the first model spectrum signal withthe actual spectrum signal; and, if the first model spectrum signal andthe actual spectrum signal do not match to a desired tolerance,repeating the receiving, selecting, generating, and comparing with asecond model profile, wherein the second model profile is selected basedon the first model spectrum signal having undergone an optimizationprocess based on a number of variable parameters of the first modelprofile, the number of variable parameters having been reduced byapproximating the first model profile to a single shape with a reducednumber of variable parameters.
 2. The method of claim 1, wherein theobject comprises at least one of a two-dimensional trapezoid and athree-dimensional trapezoid.
 3. The method of claim 1, wherein thevariable parameters comprise one or more geometric parameters.
 4. Themethod of claim 1, wherein the variable parameters comprise a refractiveindex of the material of the object.
 5. The method of claim 1, whereinthe first and second model profiles of the object comprises at least twotwo- or three-dimensional shapes, wherein each of the two- orthree-dimensional shapes has at least two variable parameters, the atleast two variable parameters comprising at least a height and a widthof each of the two- or three-dimensional shapes.
 6. The method of claim5, wherein a further variable parameter of each two- orthree-dimensional shape is an angle between two joining sides of thetwo- or three-dimensional shape.
 7. The method of claim 1, wherein avariable parameter of the object comprises a degree of freedom of theobject's shape as a result of the process of printing the object ontothe substrate.
 8. The method of claim 1, wherein the single shapecomprises at least one two- or three-dimensional shape stacked on atleast another two- or three-dimensional shape.
 9. The method of claim 1,wherein the single shape comprises at least a first two- orthree-dimensional shape within at least a second two- orthree-dimensional shape, wherein the at least second two- orthree-dimensional shape defines a coating around the at least first two-or three-dimensional shape.
 10. The method of claim 1, wherein thesingle shape comprises a plurality of separate shapes that are not incontact with each other.
 11. The method of claim 1, wherein the singleshape is asymmetrical and the method further comprises: defining arelative alignment of a plurality of shapes making up a profile of theobject wherein each of the plurality of shapes is modeled separately andcombined subsequently.
 12. An inspection apparatus configured to measurea property of a substrate, comprising: a detector configured to receivean actual spectrum signal associated with an object on the substrate; acontroller configured to select a first model profile; a generatorconfigured to generate a first model spectrum signal associated with thefirst model profile; and a comparator configured to compare the firstmodel spectrum signal with the actual spectrum signal, wherein, if thefirst model spectrum signal and the actual spectrum signal do not matchto within a desired tolerance, the controller, the generator, and thecomparator are configured to select a second model profile, generate asecond model signal spectrum associated with the second model profile,and compare the second model spectrum signal with the actual spectrumsignal, wherein the second model profile is selected based on the firstmodel spectrum signal having undergone an optimization process based ona number of variable parameters of the first model profile, the numberof variable parameters having been reduced by approximating the firstmodel profile to a single shape with a reduced number of variableparameters.
 13. A lithographic apparatus configured to measure aproperty of a substrate, comprising: a detector configured to receive anactual spectrum signal associated with an object on the substrate; acontroller configured to select a first model profile; a generatorconfigured to generate a first model spectrum signal associated with thefirst model profile; and a comparator configured to compare the firstmodel spectrum signal with the actual spectrum signal, wherein, if thefirst model spectrum signal and the actual spectrum signal do not matchto within a desired tolerance, the controller, generator, and comparatorare configured to select a second model profile, generate a second modelsignal spectrum associated with the second model profile, and comparethe second model spectrum signal with the actual spectrum signal,wherein the second model profile is selected based on the first modelspectrum signal having undergone an optimization process based on anumber of variable parameters of the first model profile, the number ofvariable parameters having been reduced by approximating the first modelprofile to a single shape with a reduced number of variable parameters.14. A lithographic cell configured to measure a property of a substrate,comprising: a detector configured to receive an actual spectrum signalassociated with an object on the substrate; a controller configured toselect a first model profile; a generator configured to generate a firstmodel spectrum signal associated with the first model profile; and acomparator configured to compare the first model spectrum signal withthe actual spectrum signal, wherein, if the first spectrum signal andthe actual spectrum signal do not match to within a desired tolerance,the controller, the generator, and the comparator are configured toselect a second model profile, generate a second model signal spectrumassociated with the second model profile, and compare the second modelspectrum signal with the actual spectrum signal, wherein the secondmodel profile is selected based on the first model spectrum signalhaving undergone an optimization process based on a number of variableparameters of the first model profile, the number of variable parametershaving been reduced by approximating the first model profile to a singleshape with a reduced number of variable parameters.